BASKET (1)Subtotal: SGD2,000.00
T1-MAP AGX Orin Module
SGD7,000.00
Introducing the AGX Orin Module Application Package and the Jetson AGX Orin Carrier Board—advanced solutions engineered to accelerate product development and deployment in AI-driven and data-intensive applications.
These systems combine cutting-edge modular design, rugged construction, and extensive connectivity options, empowering developers to build high-performance solutions for industrial automation, robotics, automotive, and military environments.
Contact our sales team today to discover how the T1-MAP AGX Orin module can accelerate your project’s success.
The AGX Orin Module Application Package leverages the FMC (FPGA Mezzanine Card) standard, renowned for scalability and rapid integration of COTS modules, significantly reducing time-to-market and development costs.
Designed for harsh conditions, it incorporates MIL-STD compliance to withstand vibration, shock, and extreme temperatures, making it an ideal choice for mission-critical deployments.
The Jetson AGX Orin Carrier Board serves as a robust, compact backbone for AI at the edge. Optimized for NVIDIA’s Jetson AGX Orin platform and the JetPack SDK, it enables accelerated AI workloads in robotics, autonomous systems, and embedded computing.
AGX Orin Module Application Package
FMC Standard Compatibility: Modular architecture supporting a wide range of COTS modules.
Ruggedized Construction: MIL-STD compliant design resistant to shock, vibration, and temperature extremes.
Advanced Connectivity: PCIe Gen3 Root/device capabilities for high-speed data transfer.
Reliable Power Delivery: Robust DC power supply ensures stable operation in mission-critical environments.
Ease of Integration: Simplified setup and seamless platform compatibility.
Jetson AGX Orin Carrier Board
Compact Size: Space-saving footprint for easy system integration.
Industrial-Grade Reliability: Engineered for extreme conditions.
Comprehensive Interfaces:
2× USB 3.2 Type-C
2× GbE Ethernet
HDMI
RS232/RS422
16× Discrete I/Os
PCIe Gen3 expansion
Expandable Storage: M.2 Key M and Key E slots for flexible storage options.
Broad Protocol Support: UART, I2C, SPI, and GPIO compatibility.
Optimized Software: Fully supported by NVIDIA JetPack SDK and AI libraries.
Our carrier board is designed to cater to a broad spectrum of industries and use cases:
Autonomous Machines
- Enable real-time decision-making in drones, autonomous vehicles, and robotic arms with low-latency processing and extensive interfacing options.
Industrial Automation
- Power predictive maintenance systems, quality control mechanisms, and robotic process automation with support for RS232, RS422, and discrete I/Os.
Healthcare and Life Sciences
- Drive AI-powered imaging solutions in diagnostics, including MRI and X-ray analysis, with the board’s high-speed PCIe and USB connectivity.
Smart Cities
- Deploy the board in applications such as traffic monitoring, intelligent lighting, and public safety systems, leveraging its robust AI processing and networking capabilities.
Edge Computing
- Ideal for edge AI systems requiring real-time analytics, the board minimizes dependency on cloud processing while maintaining high performance.
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| Power Input |
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| USB Ports |
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| Network |
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| PCIe Lanes |
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| GPIO |
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| Serial Ports |
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| Video Output |
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| M.2 Slots |
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| Operating Temperature |
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| JetPack SDK Support |
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| FMC LPC |
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1. Developer-Friendly Features:
UART for debugging.
GPIO for customization.
M.2 expansion support.
2. Packaging Includes:
Carrier board with pre-assembled Jetson AGX Orin
Comprehensive user documentation and schematics.
Access to online resources and community forums.
3. Team One Standard Off-the-Shelf FMC Modules:
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